Program Chair:
David Dagan Feng, The University of Sydney, Australia

Program Co-Chairs:
Chun Yuan, Tsinghua University, China
Rong Yan, IBM Research, China
Nicholas Vun, Nanyang Technological University, Singapore

Technical Program Committee:
Sachin Agrawal, Samsung, India
Laith Al-Jobouri, University of Essex, United Kingdom
Marco Block-Berlitz, Hochschule für Technik und Wirtschaft Dresden, Germany
Oscar Bonastre, Miguel Hernandez University of Elche, Spain
Jose Bravo, University of Castilla-La Mancha, Spain
Shengrong Bu, Carleton University, Canada
John Buford, Avaya Labs Research, USA
Yang Chen, Duke University, USA
Shanbao Cheng, FMC Tech, USA
Heeyoul Choi, Samsung Advanced Institute of Technology, Korea
Claudio Cusano, University of Milano-Bicocca, Italy
Stenio Fernandes, Federal University of Pernambuco, Brazil
Rosario Garroppo, University of Pisa, Italy
Quansheng Guan, South China University of Technology, China
Rolf Hedtke, FH Wiesbaden University of Applied Sciences, Germany
Dan Kilper, Bell Laboratories, USA
Marco Listanti, University of Rome La Sapienza, Italy
Zhu Liu, AT&T Labs - Research, USA
Shoshana Loeb, 2M Companies, USA
Reinhard Moeller, University of Wuppertal, Germany
Marie-Jose Montpetit, MIT RLE, USA
Antonio Moreno-Munoz, University of Córdoba, Spain
Derrick Wing Kwan Ng, University Erlangen-Nürnberg, Germany
Michel Ouellette, Iometrix, USA
Edward Pan, Vixs, Canada
Sharon Peng, Harman, USA
Thinagaran Perumal, University Putra Malaysia, Malaysia
Guruprasad Seshadri, Tata Consultancy Services, India
Jose Soler, Technical University of Denmark, Denmark
Jani Suomalainen, VTT, Finland
Tom Wilson, Emotion3D GmbH, Austria
Georg Wittenburg, N/A, Germany
Wei Zeng, Florida International University, USA
Bo Zhao, Tsinghua University, China
Nan Zhao, Dalian University of Technology, China
Mounir Achir, Canon Research Centre France, France
Istvan Andorko, National University of Ireland, Galway, Ireland
Ezendu Ariwa, London Metropolitan University, United Kingdom
Robin Bradbeer, Pearl Technologies Ltd, Hong Kong, China
Jianwen Chen, University of California, Los Angeles, USA
Hans Cycon, HTW Berlin, Germany
Daniel Díaz-Sánchez, Universidad Carlos III de Madrid, Spain
Wei Hong, HP Labs, USA
Libo Huang, National University of Defence Technology, China
Jin-Hwan Jeong, ETRI, Korea
Arun Joseph, IBM, India
Musaravakkam Krishnan, Intel Corporation, USA
Björn Krüger, Bonn University, Germany
Wolfgang Müller, University of Education Weingarten, Germany
Haruhiko Murata, SANYO DI Solutions Co., Ltd., Japan
Antonio Navarro, University of Aveiro, Portugal
Jose Juan Pazos-Arias, Universidad de Vigo, Spain
Tommo Reti, Research and Training Institute ReTI Foundation, Finland
Kousik Sankar, HCL Technologies, India
Euiseong Seo, Sungkyunkwan University, USA
Aalap Tripathy, Texas A&M University, USA
Dayong Wang, Tsinghua University, China
Ning Xu, Dolby Laboratories, Inc., USA
Chu Yu, National ILan University, Taiwan, China