Dr. T. Gary Yip Investigator - Intellectual Property in Electronic Systems; Consultant - Product Analysis and System Integration

Principal Investigator, Int’l Trade Commission Case for Rambus Inc., 2009-11
Technical Advisor, Office of the CEO, Rambus Inc., 2009-2012
Keynote Speaker, IEEE CECNet Conference in China, April 2012
Technical Program Chair, IEEE 2011 Int’l Games Innovation Conference
Best Technical Paper Award, 2010 Silicon Valley Test Conference
Most Inspirational Paper Award, 2010 Silicon Valley Test Conference
Outstanding Young Educator Award, SAE International
Outstanding Recent Alumnus Award, University of Illinois
Associate Fellow, American Institute of Aeronautics and Astronautics

IP Investigation
Principal Investigator in an International Trade Commission (ITC) Case for Rambus Inc, 2009-2011

Recent Papers
T. Gary Yip, Chuan Yung Hung and Venu Iyengar, “Challenges in Verifying an Integrated 3D Design,” Design, Automation & Test in Europe (DATE 2012), Dresden, Germany, March 2012.
T. Gary Yip (Editor), Proceedings of IEEE 2011 International Games Innovation Conference, IEEE Catalog No.: CFP11GIC-CDR, ISBN: 978-1-4577-0257-0, Chapman, CA, USA, Nov. 2011.
T. Gary Yip, Benedict Lau, David Secker, Joe Louis-Chandran and Mandy Ji, “Challenges in 3D Integration Due to Differences in Silicon and System Design Environments,” International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP 2011), Shanghai, China, August 2011.
Dave Secker, Yoshie Nakabayashi, Yi Lu, Arun Vaidyanath, Gnanadeep Kollipara, Philip Yeung and T. Gary Yip, “4.0 – 4.8 Gbps XDR Memory Channel for Graphics Intensive Consumer Applications,” IEEE 29th International Conference on Consumer Electronics, Las Vegas, January 2011.
T. Gary Yip, Philip Yeung, Ming Li and Deborah Dressler, “Challenges in Designing High Speed Memory Subsystem for Mobile Applications,” Design Automation and Test in Europe (DATE 2011), Grenoble, France, March 2011.
Pardeep Batra, Adrian Torres, William Ng, Arun Vaidyanath, Philip Yeung and T. Gary Yip, “LabStation: A Low Cost, Scalable, High Throughput Characterization Environment,” Silicon Valley Test Conference, San Jose, November 2010.
Adrian Torres, Pardeep Batra, Brian Tsang and T. Gary Yip, “Low Cost, Transportable Power Platform and Flexible Interface for Multiple Hardware Protocols,” Silicon Valley Test Conference, San Jose, November 2010.
T. Gary Yip, “Control of Clock Jitter in High Speed Data Links,” Silicon Valley Test Conference, San Jose, November 2010.
T. Gary Yip, Deborah Dressler, Brian Tsang, Adrian Torres and Philip Yeung, “Low Power and Low EM Emission DRAM Memory Interface for HD Video Recording in Mobile Devices,” International Conference on Green Circuits and System, Shanghai, China, June 2010.
T. Gary Yip, Wendem Beyene, Gnanadeep Kollipara, William Ng, and June Feng, “Electrical-Thermal Co-design of High Speed Links,” Electronic Components and Technology Conference, Las Vegas, June 2010.